On September 19, Prof. Yang Zhao, an Editorial Board Member of Thermo-X, introduced the journal at the 2026 1^st Symposium on Chip Heat Dissipation. She also exchanged views with conference participants on the journal's aims, scope, and development.

The Thermo-X Editorial Office sincerely thanks Prof. Yang Zhao for her support in promoting the journal. We also appreciate the attention and recognition from the research community. Thermo-X will continue to provide an open and professional platform for academic exchange and support the development of thermal science and its applications.

About 2026 1^st Symposium on Chip Heat Dissipation

The 2026 1^st Symposium on Chip Heat Dissipation was successfully held in Hefei, Anhui, from September 17 to 19, 2026. The symposium focused on emerging topics and advances in chip heat dissipation, bringing together researchers and experts for academic and technical discussions on fundamental principles and cutting-edge applications. The event provided a platform to exchange ideas on emerging trends in the field, foster interdisciplinary collaboration, and facilitate the sharing of research findings and expertise among scholars.

For more information about the conference, please click this link: https://mp.weixin.qq.com/s/eJgUei5AzdZI2-5AeMT0Yg