The precise evaluation of real-world thermoelectric cooling (TEC) performance is vital for both the development of TEC devices and the rational design of TEC materials. Due to the relatively limited temperature difference (ΔT) that a single-stage TEC can achieve, the classical analytical formulae for thermoelectric cooling are commonly used with averaged material properties in the cooling performance evaluation. Nevertheless, this could cause remarkable errors in evaluations of the cooling power, even under a ΔT as low as 10 K. In this work, a cumulative model for thermoelectric cooling is proposed to evaluate the maximum coefficient of performance (COP) as well as the maximum cooling power of a TEC device under finite temperature differences, with the temperature dependence of material properties being fully considered. The inherent deficiencies in predicting the maximum cooling power by both the classical formulae and the original cumulative model are identified, and effective refinements are implemented to reduce the prediction error. Eight thermoelectric materials with state-of-the-art ZT values near room temperature are assessed for electronics cooling scenarios within a cold side temperature (T_c) range of 300-350 K. In comparison to the classical formulae, the proposed model predicts the maximum COP with comparably satisfying accuracies (±2%), while significantly improves the prediction accuracy of the maximum cooling power from approximately ±30% to within ±5% over a ΔT range of 10-70 K. This work fills the gap between thermoelectric material properties and device-level cooling performance, and is beneficial to the development and application of thermoelectric conversion technology for cooling purposes.

Thermal transport at the nanoscale is fundamentally important and crucially impacts a range of applications from electronic chip cooling to advanced energy technology. Inspired by the rise of twistronics, twist engineering has recently emerged as a powerful approach to control nanoscale heat flow, which leverages interlayer rotation in van der Waals materials as a new degree of freedom. Here, we first briefly introduce the basic principles of twist engineering. Subsequently, we discuss various experimental techniques and computational approaches for investigating phonon-mediated heat conduction, together with key results and physical mechanisms for the active manipulation of both out-of-plane and in-plane transport. Furthermore, we review advances in the twist-induced modulation of photon-mediated thermal radiation, distinguishing strategies that tune intrinsic optical responses from those utilizing extrinsic couplings. We conclude with remarks on the opportunities and challenges for future exploration of twist-engineered thermal management and energy conversion.

Thermal routing refers to the ability to direct heat energy from a source to a selected drain, offering great potential for asymmetric thermal path regulation. However, existing approaches to asymmetric heat transport largely rely on phononic band engineering and mechanically moving components, typically limited to heat fluxes at the microwatt level or complicated experimental configurations with long-term reliability concerns. Herein, inspired by the analogy between thermal advection and thermoelectric effects in dragging heat energy, we propose a solid-state thermal metadevice featuring large heat energy flux and near-unity thermal split ratio. By examining the evolutionary path of the Seebeck coefficients, the unique asymmetry-enhancement mechanism arising from the commonly-overlooked Thomson effect is revealed, enabling an improved thermal splitting effect of the device. Free of mechanically moving components, this work provides a new paradigm for the design of solid-state thermal routers with great power and electrical reconfigurability. It makes a promising candidate for compact thermal management and thermal logic processing where asymmetric time-varying heat energy reallocation matters.

High-heat-flux chips in high-performance computing, heterogeneous integration, and wide-bandgap electronics are reaching a thermal-management ceiling: transistor-scale hotspots, dense stacks, and low-conductivity interlayers force heat through resistive, interface-rich paths before it reaches the coolant. Microfluidic cooling can support 10²-10³ W/cm² heat fluxes and higher local loads, yet it is often framed as a competition among microchannels, jets, manifolds, two-phase structures, and high-conductivity spreaders. This review reconstructs the field through thermal-path compression and bottleneck migration, using cooling-boundary location, compressed resistance segment, and residual limit as organizing axes. As cooling advances from package-integrated schemes to embedded/interposer and near-junction architectures, the dominant limit shifts from package-side conduction to hotspot spreading, solid–solid/solid–liquid interfacial resistance, hydraulic allocation, and confined phase instability. Representative architectures are assessed through heat flux, pressure drop, area-normalized thermal resistance, and evidence maturity, emphasizing that record heat flux is not transferable without defined heated area, temperature criterion, coolant state, hydraulic cost, and device boundary. We further distinguish proof-of-concept thermal vehicles from device-relevant, package-compatible, and deployment-oriented platforms by considering manufacturability, sealing and leakage risk, semiconductor-process compatibility, coolant/material compatibility, and scale-up to large-area or multi-chip systems. Interface engineering and diamond-enabled platforms show that high intrinsic conductivity is useful only through reliable, low-resistance, and manufacturable interfaces. This framework recasts microfluidic cooling as near-junction co-design rather than a heat-flux race.

Carbon fibers (CF)/epoxy composites are widely utilized in aerospace and transportation due to their light weight and high specific strength/modulus. However, poor interfacial binding between CF and the epoxy matrix leads to phonon scattering and inefficient load transfer, causing heat accumulation and reduced service life in high-power electronic systems. In this study, CF was coated with a styrene, benzocyclobutene, and methyl methacrylate units containing polymer layer mixed with carbon nanotubes (CNT) through impregnation and drying. The polymer layer was then thermally crosslinked to obtain the polymer and CNT coated CF (CF@(CNT/P)). CF@(CNT/P) was then applied as reinforced fibers and epoxy resin containing a liquid crystal structure as the matrix to prepare CF@(CNT/P)/epoxy composites. The π-π interactions and hydrogen bonds between CF and epoxy resin were enhanced by the benzene ring and ester groups in the polymer, thereby improving the interfacial binding between epoxy resin and CF. CF@(CNT/P)/epoxy composite showed enhanced load-bearing and thermal conduction performance. When the mass fractions of CNT and copolymer in CNT/P/dichloromethane (DCM) solution were 0.03 wt% and 0.1 wt%, respectively, the CF@(CNT/P) had the best interfacial binding to the epoxy resin. The interlaminar shear strength and flexural strength of the CF@(CNT/P)/epoxy composite increased from 23.7 and 252.5 MPa of CF/epoxy composite to 31.4 and 369.1 MPa, respectively. Meanwhile, the in-plane (λ_∥) and through-plane (λ_⊥) thermal conductivity values were improved from 7.15 and 0.31 W/(m·K) of CF/epoxy composite to 10.08 and 0.58 W/(m·K), respectively. The CF@(CNT/P)/epoxy composite also demonstrated an electromagnetic interference shielding effectiveness of 38.6 dB which has broad application in high-power electronic information systems.

Deep eutectic solvent (DES) based nanofluids have gained ample attention owing to their extraordinary thermophysical properties such as wide temperature range and thermal stability. While poor static stability of DES based nanofluids heavily hinders their practical application due to the incompatibility with dispersants. Herein, a novel zinc oxide (ZnO) nanofluids using ethylene glycol and potassium acetate DES for solar thermal utilization were developed. With the aim of addressing the poor stability, a one-step in situ synthesis involving microwave-induced dehydration was employed to prepare self-dispersing ZnO nanoparticles without external dispersants. Thermophysical properties and photothermal performance of nanofluids with varying mass fractions (0.5-5 wt.%) were systematically investigated. Results indicate that ZnO inclusion significantly improves thermal conductivity and photothermal conversion. Specifically, the 5 wt.% sample exhibited a 12% increase in thermal conductivity at 65 °C compared to the base fluid, while the 0.5 wt.% sample demonstrated optimal photothermal response under low light intensity. Additionally, the fluids displayed anomalously enhanced specific heat capacity (up to 14.6%), attributed to the formation of ordered interfacial liquid layers on the high-surface-area ZnO nanoparticles through electrostatic interactions and hydrogen bond rearrangement, offering dual advantages in heat transfer and storage, while maintaining dispersion stability for approximately two weeks, which thus presents a low-cost, stable, and environmentally friendly strategy for developing heat transfer fluids suitable for medium-to-high temperature solar collection systems.

Two-dimensional (2D) heterostructures provide an unusually versatile platform for engineering interfaces at the atomic scale. As these materials move toward electronic, optoelectronic and multifunctional devices, heat flow across their interfaces is emerging as a central factor that governs performance, stability and reliability. Interfacial thermal transport has traditionally been treated as a material-pair-specific conductance that should be measured and optimized. In 2D heterostructures, however, the interface is not a passive boundary with a fixed thermal response. Its conductance is shaped by the structural history, local configuration and dynamic state of the interface. In this perspective, we discuss how interface formation, thermal metrology and microscopic phonon mechanisms together define heat flow across atomically thin heterointerfaces. We highlight how direct growth and transfer assembly create distinct opportunities for lateral and vertical interfaces, how Raman thermometry, pump-probe thermoreflectance and electrical methods quantify interfacial transport, and how elastic transmission, inelastic scattering and interface-specific vibrational states govern nanoscale heat flow. We then consider how intrinsic and external control of 2D heterointerfaces can be used to tune conductance for heat dissipation, local heat confinement, rectification and thermal switching. We argue that the future of the field lies in moving from passive characterization of interfacial thermal conductance toward predictive, spatially resolved and actively controlled heat flow in 2D heterostructures.

Imaging thermal properties at the microscale is crucial for unveiling the structure-property relation and developing next-generation thermal management materials. Here, we apply a frequency-domain thermoreflectance (FDTR) microscopy for imaging the thermal conductivity and interfacial thermal conductance of thermal interface materials (TIMs). A fixture customized for imaging thermal properties of TIMs is developed, where the sample is sandwiched between a silica slide coated with a metal transducer and a substrate wafer, and the thermal transport properties are extracted using a bidirectional thermal model. The thermal conductivity of TIMs loaded with thermally conductive particles is profiled with micrometer resolution, and significant local non-uniformity is observed. Pressure-dependent FDTR imaging during loading and unloading reveals the local redistribution of conductive filler particles. Correlative micro-computed tomography reveals that the high thermal conductivity regions correspond to the aggregation of thermally conductive particles. Further statistical analysis of the FDTR image unveiled the asymmetrical and long-tailed probabilistic distribution of thermal conductivity values. Through statistical modeling, we demonstrate that this asymmetry originates from the lognormal size distribution of microparticles. Our work sheds light on the structure-property relation between microstructure and thermal conductivity distribution of TIMs at the microscale.

Supercooling perfusion extends organ-preservation time by maintaining grafts ice-free below 0 °C, but thermal non-uniformity and limited intra-organ temperature observability hinder protocol design, especially at large-organ scales. We developed an anatomically based thermo-fluidic modeling framework for supercooled perfusion of the liver, heart, and kidney in a recirculating multi-organ configuration and validated the model experimentally. Three-dimensional organ geometries from the BodyParts3D repository were combined with a porous-media tissue representation and realistic perfusion boundary conditions to resolve transient intra-parenchymal temperature fields. A self-developed variable-frequency supercooled machine perfusion (MP) platform was used to measure temperatures in porcine livers, hearts, and kidneys using multiple thermocouples placed at anatomically corresponding locations. Simulated temperature trajectories agreed with measurements across organs, with mean absolute errors of 0.24 °C for the liver, 2.63 °C for the heart, and 0.4 °C for the kidney, and reproduced initial cooling followed by progressive approach to the perfusate temperature and stabilization. Spatial temperature maps captured organ-specific gradients consistent with convective heat extraction by perfusate delivery and conductive transport within tissue. Using the validated model, we performed parametric sweeps of the inlet perfusion parameter, perfusate thermophysical properties, and external convective heat-transfer coefficient to quantify their effects on cooling rate and temperature uniformity. Based on quantitative metrics, these parameters were found to influence cooling rate and intra-organ temperature uniformity to different degrees, while the magnitude of improvement differed among organs due to size and vascular characteristics. This study provides a validated, under the tested conditions, tool to predict intra-organ temperature evolution and a guide for thermodynamically optimizing supercooled MP protocols in multi-organ preservation.

Anomalous cooling or heating implies attractive underlying thermal physics, and the Mpemba effect and its inverse are typical examples. Most existing explanations for such phenomena are based on microscopic Markovian models that quantify relaxation using distance measures such as total variation distance or Kullback‑Leibler divergence. Here, we propose a macroscopic network system to observe and analyze the Mpemba effect and its inverse by connecting a thermoelectric module with a body and a reservoir at different initial temperatures. Normal cooling and anomalous cooling can be switched in such a setup, and oscillatory behaviors of temperature, current, and heat flow are found to be the key for achieving the Mpemba effect and its inverse. With an unambiguous definition of the criteria, the occurrence domain of the Mpemba effect is sketched in terms of initial temperature, thermoelectric Figure-of-Merit, and the inductance. This work provides a macroscopic network system to understand the Mpemba effect, and offers a more flexible and dynamic way for thermal management and energy conversion.

Hydrogen is widely recognized as the leading green energy carrier of the 21st century, owing to its diverse production pathways, high combustion energy density, and environmentally benign byproduct: water. However, its wide flammability range (4-75 vol.% in air) and extremely low minimum ignition energy (0.02 mJ) pose significant safety risks across the entire lifecycle of production, storage, transportation, and utilization, necessitating real-time monitoring through highly reliable sensing technologies. Among various hydrogen detection methods, thermal conductivity sensors have attracted considerable attention due to their oxygen-independent operation, broad measuring range, mechanical robustness, and long service lifespan. Despite growing research interest, there remains a notable lack of comprehensive review articles specifically dedicated to thermal conductivity hydrogen sensors (TCHSs) that consolidate the current state of knowledge and guide future research directions. This paper presents a systematic analysis of the working principles and operating modes of TCHSs, introduces key performance parameters, and reviews theoretical models describing the effective thermal conductivity of gas mixtures. The discussion covers representative sensor architectures, gas inlet configurations, and critical environmental factors influencing sensor performance. Furthermore, recent advances and emerging trends are examined, with particular emphasis on smart gas sensing technologies enabled by sensor integration and advanced machine learning algorithms. This study aims to serve as a comprehensive academic reference, offering a clear and structured framework for researchers, particularly those newly entering the field of hydrogen sensing.

Thermal Hall effect (THE) refers to the phenomenon whereby, in a magnetic field, when a longitudinal heat current flows through a material, the heat carriers are deflected, thereby generating a transverse temperature difference between the two lateral edges. The transition from electrical to thermal transport enables this effect to involve a wide range of carriers, thereby providing a unique perspective for investigating complex quantum states in condensed matter physics. THE is increasingly becoming a powerful probe of neutral excitations in materials and is used to explore multifield control phenomena in magneto-thermal-electrical coupled systems. Advances in the field of THE have significantly advanced the study of condensed matter systems under extreme conditions (low temperatures and strong magnetic fields) and have laid the groundwork for exploring novel magneto-thermal-electrical effects in quantum materials. This review systematically reviews recent theoretical and experimental progress on THE, with particular attention to the underlying heat carriers. Through an in-depth analysis of the transport mechanisms of different carriers, quantum material systems that can be used to investigate multicarrier coupled transport are identified, which will significantly facilitate the synergistic control of magneto-thermal-electrical transport in complex interacting systems. Finally, we propose a novel in situ, multiparameter integrated characterization method that enables simultaneous and precise measurement of magnetic, thermal, and electrical parameters on the same micro/nanoscale samples. This approach not only overcomes the limitations of bulk materials but also serves as a key experimental platform for revealing the mechanisms of multicarrier coupled transport in micro/nano samples.

This work investigates the transport of an electron bubble near the free surface of superfluid ³He-B under applied electric and magnetic fields. Based on a theoretical framework combining the quasiclassical Green’s function and the Lippmann–Schwinger equation, we have calculated the scattering cross section and mobility of the electron bubble, together with their temperature and depth dependences. An electric field shifts the position of the electron bubble and thereby tunes its coupling to the surface bound states. The surface density of states decays with depth, whereas the transport cross section increases with energy and depth; these competing trends compensate, resulting in a nearly depth-independent mobility consistent with the linear dispersion of the surface states. In contrast, an applied magnetic field opens a Zeeman gap in the surface-state spectrum, which breaks the linear dispersion of the bound states. Our results demonstrate that external electric and magnetic fields provide effective control of the spectral structure and scattering properties of the surface bound states.

Driven by the escalating chip-level heat flux demands of artificial intelligence and high-performance computing, thermal management has emerged as a critical bottleneck for next-generation microelectronic integration. To address the prominent contradiction between the limited space and the high heat flux in silicon interconnect fabric chips, this research has overcome the key challenge of miniaturizing traditional spray cooling by designing and implementing an ultra-thin spray cooling heat sink embedded in a silicon-based test chip. The core advancement stems from a synergistic integration of topology-optimized micro-nozzle architecture and silicon-based microfabrication, achieving a total spray module thickness of merely 3.5 mm and enabling uniform near-field atomization from four nozzles under low pressure. Experimental results demonstrate that the heat sink removes 614 W at a junction temperature of 92 °C from a compact footprint of 9.5 mm × 9.5 mm, yielding a peak surface heat transfer coefficient of 9.03 W/(cm²·K). This performance not only validates the feasibility of spray cooling in ultra-thin packaging architectures, but also presents one of the first experimental demonstration of the monolithic integration of a spray cooling system with a silicon-based integrated circuit. This work establishes a viable pathway for ultra-high heat flux thermal management under extreme spatial constraints, enabling the practical deployment of spray cooling in high-power-density electronics, including high-performance computing and artificial intelligence chips.

Effective thermal management is crucial for global sustainability, yet it faces a fundamental challenge: traditional materials cannot dynamically regulate the three coupled heat transfer modes, namely conduction, convection, and radiation, in complex, real-world environments. To overcome this, we present a paradigm shift from material selection to the architectural design of synergistic heat transfer. This perspective explores how multimodal thermal metamaterials, through engineered microstructures and topology, enable programmable control over coupled thermal flows. We highlight how this approach yields advanced functionalities, including directional guidance, adaptive cooling, and waste-heat recovery, across scales ranging from microelectronics to buildings and marine systems. This architectural design framework transcends intrinsic material limits, establishing a foundational pathway toward intelligent, high-efficiency, and sustainable thermal technologies essential for energy sustainability.

The increasing die size, package dimensions and operating heat flux of AI chips impose stringent requirements on the mechanical compliance and reliability of chip-level thermal interface materials (TIMs). Polymer-based TIMs, particularly silicone gels, offer advantages such as mechanical flexibility, automated dispensability, and warpage accommodation in large packages; however, their application is limited by weak interfacial adhesion and siloxane volatilization. Therefore, it is essential to develop advanced non-silicone thermal gels. This study reports a poly(ionic liquid) (PIL)-based thermally gel TIM. The TIM was fabricated by dispensing a mixture of ionic liquid monomer, Al₂O₃ thermal filler, and initiator, followed by thermal curing, making it compatible with FCBGA dispensing processes (the viscosity before curing was 225 Pa·s). With 70 vol% Al₂O₃ filler, the PIL-based TIM exhibited a low storage modulus of 255 kPa and high interfacial adhesion strengths of 0.95 MPa to Cu and 0.91 MPa to Si. The intrinsic thermal resistance reached 2.4 × 10^-5 m²·K/W, comparable to that of conventional silicone systems. Notably, the interfacial contact thermal resistance with Si (R_c = 1.95 ± 0.87 × 10^-7 m²·K/W) was an order of magnitude lower than that of silicone-based TIMs. Reliability tests showed > 98% coverage after three accelerated aging tests, with no leakage or volatilization. The proof-of-concept study validates the feasibility of PIL-based TIMs and highlights their significant potential for further optimization in next-generation AI thermal management.

The high integration density of modern energy and information devices often results in high power density and intense heat flux. Depending on the operating and optimal temperature range of the device, heat must be either effectively dissipated or retained. Precise regulation of heat flow is essential for the advancement of next-generation energy and information technologies. Dynamic heat flow control and nonlinear thermal transport open new avenues for developing smart battery thermal management systems, solid-state refrigeration devices, and thermal logic elements analogous to electronic circuits. Due to their unique capability to actively modulate heat transfer and exhibit thermal rectification behavior, thermal switches and thermal diodes have shown great potential in managing heat and/or maintaining thermal stability beyond the limits of conventional passive thermal materials and devices. Here, we review recent progress in the design principles, fundamental mechanisms, and applications of thermal switches and thermal diodes for energy and information technologies, and evaluate their potential for practical deployment. Furthermore, we discuss the emerging demands in these sectors and provide future perspectives to inspire applied research toward solving real engineering challenges.

We investigate how metallic rattling modes in Sr₂HgSn simultaneously suppress particle-like (κ_p) and enhance wave-like (κ_c) thermal conductivity via a combined first-principles, force-constant modulation, and Wigner transport analysis. Weak Hg-Sn bonds generate flat phonon bands that relax momentum conservation, intensifying both three- and four-phonon scattering and shortening phonon lifetimes. This dual scattering-coherence mechanism reveals a frequency-selective κ_p - κ_c crossover, leading to a weak temperature-dependent κ_L. Our work establishes rattling as a tunable design strategy for controlling phonon transport in thermoelectrics.

Phonon hydrodynamics is a theoretical framework for predicting nondiffusive heat transport processes in solids at the nanoscale or under high-frequency excitations. This article presents the microscopic and thermodynamic foundations of the theory and reviews its applications. First, we discuss historical and modern derivations of hydrodynamic heat transport equations from the phonon Boltzmann transport equation (BTE), and highlight advanced methods to predict hydrodynamic effects from direct solutions of the BTE beyond the Relaxation Time Approximation. Then, we review the main experiments that uncovered nondiffusive heat transport effects and their interpretation from the hydrodynamic perspective. Overall, the developments summarized in this work establish phonon hydrodynamics as a vital tool for understanding and engineering thermal transport at the nanoscale in data-processing and energy-conversion devices.

The two-temperature model (TTM) has been widely employed in describing ultrafast relaxation dynamics, providing a simple yet powerful framework to study energy relaxation in photoexcited systems. Recently, the time-dependent Boltzmann equation (TDBE) has revealed the limitations of TTM. However, current implementations of the TDBE assume instantaneous electronic thermalization. In this work, we employ first-principles Boltzmann transport simulations to explicitly examine the impact of non-thermal electronic distributions on relaxation processes. By comparing gold, silver, and aluminum as representative cases, we show that while phonons can indeed remain far from equilibrium, the neglect of non-thermal electrons is far more consequential. For gold, the absence of strongly coupled scattering channels makes the influence of non-thermal electrons negligible, rendering the TTM valid. For silver, deviations from the TTM stem mainly from non-thermal electronic effects, and for aluminum, both non-thermal electrons and phonons lead to substantial discrepancies. These findings demonstrate that non-thermalized electrons play a decisive role in out-of-equilibrium ultrafast energy transfer between electrons and phonons, offering a new perspective on the limitations of the TTM.

Phase change materials possess significant potential for solar-thermal energy storage yet face critical limitations, including structural instability, inherently poor heat conductivity, and inadequate solar absorption, thereby constraining their practical applications. To address these challenges, we developed a laminated phase change composite (PCC) via pressure-assisted lamination of paraffin wax-olefin block copolymer (PW-OBC) with expanded graphite (EG) sheets. Experiments indicate that the OBC in the well-mixed PW-OBC sheet forms a three-dimensional network that encases the PW, enabling excellent leakage resistance, thermal/cyclic durability, and shape stability. The parallel EG sheets establish directional and continuous heat transport channels, resulting in 4.54 W·m^-1·K^-1 lengthwise heat conductivity versus a transverse value of 0.49 W·m^-1·K^-1, with an excellent thermal conductive anisotropy of 9.27. Coating the PCC surface with carbon black enhances its solar irradiation absorption, yielding a solar absorptivity of 0.98. Benefiting from the synergy of anisotropic heat conduction and enhanced solar absorption, the PCC can attain 79.2%-96.5% solar-thermal efficiency within 1-3 suns irradiance, enabling effective solar energy capture and storage. These results provide a viable approach for producing high-performance, anisotropically conductive PCCs for efficient low- to medium-temperature solar-thermal applications.

The electrocaloric (EC) effect represents the changes of polarization entropy and/or temperature of dielectrics when an external electric field is applied and removed. An efficient EC effect relies on a highly reversible conversion between electrical energy and thermal energy. Based on this effect, EC refrigeration has demonstrated advantages in terms of high energy efficiency, zero direct carbon emissions, and high specific volumetric cooling power densities. Consequently, EC refrigeration is recognized as one of the promising alternative technologies for next-generation refrigeration and heat pump. Over the past two decades, EC cooling devices have been extensively developed, driven by advances in EC materials and working bodies. In this review, we summarize recent progress in EC cooling devices, focusing on the mechanisms of solid-state refrigerants and thermodynamic cycles within these systems, and highlighting the characteristics of devices operating on different working principles.

Enhancing indoor visual comfort is crucial for the practical deployment of thermochromic smart windows. However, their application is often hindered by the low visible light transmittance (T_lum) in the activated state. In this study, we propose a thermally and optically dual-responsive smart window that improves both building energy efficiency and T_lum in the activated state. The design is based on a polyacrylamide (PAm)/poly(N-isopropylacrylamide) (PNIPAm)/indium tin oxide (ITO) composite film (PPI). Within this structure, PAm provides a hydrophilic matrix, PNIPAm microgels enable thermoresponsive optical modulation through reversible transmittance changes across the response temperature, and ITO particles act as light-to-heat transducers due to their photothermal and infrared reflective properties. Compared with the PNIPAm hydrogel film, the PPI composite film increases T_lum in the activated state from 9.7% to 50.0% and enhances infrared modulation capability from 39.2% to 50.4%. Under an illumination intensity of 95 mW·cm^-2, the PPI composite film lowers the indoor temperature of simulated buildings by up to 7 °C. This dual-responsive thermochromic window provides improved indoor visual comfort along with effective temperature regulation, offering a promising strategy for advancing the practical use of smart windows.

With the continuous miniaturization of micro-devices and the rapid advancement of novel nanomaterials, thermal characterization techniques tailored for two-dimensional (2D) structures (films and coatings) and one-dimensional (1D) architectures (wires and fibers) have become essential for elucidating structure-property relationships and optimizing material performance. This review provides an in-depth analysis of the Transient Electro-Thermal (TET) technique, a recently developed method for measuring the thermal diffusivity and conductivity of 1D and 2D materials, including dielectric, metallic, and semiconductive films, coatings, and wires/fibers. We discuss the fundamental principles of TET operation, the associated physical and mathematical models for data reduction, and critical methodologies for data fitting, uncertainty analysis, and stray heat transfer mitigation to ensure high repeatability and accuracy. In addition, the latest developments and applications of TET are highlighted, including its extension to atomic-scale thickness, in-situ dynamic thermal property measurements during structural evolution, and the zero-temperature-rise limit method. The outstanding agreement (within ~0.6%) between the measured and reference thermal diffusivity of a Pt wire, validated through extensive experiments and zero-temperature-rise extrapolation, demonstrates the robustness and reliability of the TET technique. Owing to its simplicity in principles, experimental implementation, and data analysis, TET offers significant advantages in uncertainty control, measurement accuracy, and throughput.

Antiperovskites have attracted significant interest in the field of energy conversion in recent years. While extensive research has focused on the magnetism, ionic conductivity and superconductivity of antiperovskites, their thermal properties including lattice anharmonicity and thermal transport remain less explored compared to their well-studied perovskite counterparts. Recently, nitrohalide double antiperovskites have been successfully synthesized. In this work, we investigate the thermal transport properties of nitrohalide double antiperovskites Li₆NII₂ and Li₆NBrBr₂ using first-principles machine-learning potentials. Our results reveal that within the perturbation theory framework, imaginary phonons appear throughout the entire Brillouin zone in both the harmonic regime and at elevated temperatures. Atomic vibrational analysis indicates that stochastic Li-ion movements confined within a single conventional unit cell are responsible for the presence of these imaginary phonons. Furthermore, homogeneous nonequilibrium molecular dynamics and equilibrium molecular dynamics simulations demonstrate that Li₆NII₂ and Li₆NBrBr₂ exhibit ultralow glass-like lattice thermal conductivities. Spectral thermal conductivity analysis shows that the dominant contributions arise from phonons with frequencies below 5 THz and around 11 THz. The substantial phonon contribution near 11 THz is attributed to the confined stochastic motions of Li ions. This work uncovers the unconventional microscopic cation dynamics and strong lattice anharmonicity in double antiperovskites Li₆NII₂ and Li₆NBrBr₂, thereby advancing the understanding of phonon transport in these materials.