Special Issue Information

Inspired by the multifunctionality of natural skin, electronic skins have emerged as a transformative technology capable of mimicking and extending human sensory functions through flexible, stretchable, and intelligent systems. With their unique ability to detect and respond to various stimuli-including pressure, strain, temperature, humidity, and biochemical signals-electronic skins are becoming essential in next-generation wearable electronics, soft robotics, healthcare monitoring, and immersive human–machine interfaces. Furthermore, haptic feedback plays a pivotal role in bridging sensing and action: it enables bidirectional communication by delivering tactile, vibrational, or thermal cues to users, thereby restoring the sense of touch in prosthetic limbs, enhancing teleoperation precision in robotic surgery, and creating realistic immersion in virtual environments. Emphasis is placed on innovative materials, device architectures, and signal processing strategies that enhance sensitivity, durability, multifunctionality, closed-loop feedback, and real-time responsiveness, paving the way for electronic skins that truly replicate and augment the natural sense of touch.

This Special Issue aims to highlight the latest advancements and emerging trends in electronic skins (e-skins), from advanced material design to device integration and close-loop interaction applications. The topics covered include, but are not limited to:
• Design and synthesis of flexible, stretchable, self-healing, and biocompatible materials for e-skins
• Novel sensing mechanisms for pressure, strain, temperature, humidity, and biochemical detection
• Multimodal and multifunctional electronic skin systems
• Energy harvesting and self-powered electronic skins
• Signal processing, artificial intelligence, and data interpretation for smart sensing
• Electronic skins for healthcare monitoring, prosthetics, and rehabilitation
• Human–machine interfaces, tactile sensing, haptic feedback and close-loop systems

This Special Issue aims to highlight breakthroughs that bridge the gap between fundamental materials development and practical implementation in robust, high-performance e-skin systems for real-world applications.

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